high speed CDSU400 features designed for mounting on small surface. extremely thin/leadless package. low leakage current. high mounting capability, strong surge withstand, high reliability. mechanical data case: 0603 (1608) standard package, molded plastic. t erminals: gold plated, solderable per mil-std-750, method 2026. polarity: indicated by cathode band. mounting position: any. weight: 0.003 gram (approximately) smd switching diode smd switching diode parameter repetitive peak reverse voltage reverse voltageaverage forward current forward current , surge peak power dissipation storage temperaturejunction temperature conditions symbol v rrm v r i o i fsm p d t stg t j min -40 -40 max 90 80 100 150 +125 +125 typ 1000 unit v v ma ma mw www.com chip.co m.tw c o m c h ip c o m c h ip maximum rating ( at t a = 25 c unless otherwise noted ) electrical characteristics ( at t a = 25 c unless otherwise noted ) c c preliminary 0.0 71( 1.8 0) 0.0 63( 1.6 0) 0.0 10( 0.2 5) ty p. 0.0 39( 1.0 0) 0.0 31( 0.8 0) 0.0 33 ( 0.8 5) 0.0 27 ( 0.7 0) dim en sio ns in in ch es an d ( mi llim ete r) 06 03 (1 60 8) 0.0 12 ( 0.3 0) ty p. 0.0 14( 0.3 5) ty p. unit v ua pf ns parameter forward voltage reverse currentcapacitance between terminals reverse recovery time conditions i f = 100 ma dc v r = 80 v f = 1mhz, and 0.5vdc reverse voltage v r = 6v, i f = 10 ma, r l =50 ohms symbol v f i r c t trr min typ 3 4 max 1.0 0.1 rds0301001-b 8.3 ms single half sine-wave superimposed on rate load ( jedec method ) (lead-free device)
rating and characteristic cur ves (CDSU400) smd switching diode smd switching diode www.com chip.co m.tw c o m c h ip c o m c h ip reverse voltage (v) r e v e r s e c u r r e n t ( a ) 0.2 0.4 0.8 0 1.0 0.6 10 0n 10 0p 10 00 m 10 m 1 00 m 1u 10 n 1n 1.2 1m 10 0u 10 u 0 10 20 30 40 50 60 70 80 reverse voltage : (v) c a p a c i t a n c e b e t w e e n t e r m i n a l s : ( p f ) 0 5 10 15 20 25 30 0 1.0 2.0 3.0 4.0 5.0 f=1mhz ta = 25 c ambient temperature ( c) forward voltage (v) a v e r a g e f o r w a r d c u r r e n t ( % ) f o r w a r d c u r r e n t ( a ) rds0301001-b 10 u 7 5 c 1 2 5 c - 2 5 c 2 5 c 75 c 125 c 25 c 0 20 40 60 80 10 0 0 25 50 75 100 125 150 mounting on glass epoxy pcbs fig. 1 - forw ard cha racte ristic s fig. 2 - rev erse ch aract eristi cs fig. 4 - curre nt d erating curve fig. 3 - cap acita nce bet ween te rmina ls chara cteris tics
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